We had the pleasure of welcoming the CEO David Moore and Head of Sales Alex Shang from Pragmatic Semiconductor to our Shenzhen headquarters — exploring what's next in NFC FlexIC collaboration.

On the agenda: building the future of connected packaging together:

NFC FlexIC application development

INLAY manufacturing partnership

Smart packaging solutions at scale

The momentum in this space is undeniable. Just this week, Tageos launched the world's first FlexIC-based NFC inlay product lines — powered by Pragmatic's ultra-thin PR1301 chip. The ecosystem is moving, and RZX is moving with it.

With 20 years of RFID manufacturing expertise, 3 production bases, and an annual capacity of 5 billion units — we are built for what comes next.

The future of smart packaging is here. And we're ready to build it.